Densil P dithio-2,2-bis(benzmethylamide) 2527-58-4 Avecia Preservatives / Biocides / Fungicides SEALANT ADHESIVE >> Water-based DENSIL P is a broad spectrum fungicide for the dry film protection of aqueous based surface coatings and adhesives. It can also be employed for the wet-state preservation of industrial water-based products against spoilage from bacteria, yeasts and fungi. DENSIL P is a 25% w/w aqueous dispersion of dithio-2,2-bis(benzmethylamide). DENSIL P is effective in a wide range of industrial aqueous-based products. Dry film fungicide applications Water-based adhesives Sealants Wet state preservation applications Water-based adhesives Wet state preservation applications (cont) Tape joint compounds Leather processing solutions 25% aqueous dispersion of dithio-2,2-bis(benzmethylamide). Fungicide for the dry film protection of aqueous based surface adhesives and sealants. Can also be used for the wet-state preservation of industrial water-based products against spoilage from bacteria, yeasts and fungi. Use level in dry film fungicide applications: 0.20-2.00 %wt in water-based adhesives 0.50-2.00 %wt in sealants Use level in wet state preservation applications: 0.05-0.2 %wt in water-based adhesives