Polybutene-1 DP 8910 PC Copolymer of butene-1 and ethylene 25087-34-7 Basell Ethylene co-terpolymers - solid (EVA, EMA) ADHESIVE >> Hot-melt SEALANT Polybutene-1 development grade DP8910PC resin is a random copolymer of butene-1 with high ethylene content, containing free organic peroxide additives. Polybutene-1 grade DP8910PC is primarily used as a blend component in hot melt adhesive (HMA) formulations and sealant compounds, in order to increase open time and maintain mechanical integrity at higher temperatures (higher shear adhesion failure temperature or SAFT). It can be used in combination with a wide variety of non-polar resins and waxes. The presence of free organic peroxides in polybutene-1 grade DP8910PC allows the reduction of melt viscosity in elevated temperature processing. The rate of further peroxide cracking depends on the time and temperature of processing. To achieve 100% utilization of the residual peroxide, a temperature of 180ºC or higher should be applied for at least 30 minutes. In order to achieve the target viscosity at 350ºF, the product should be kept in a closed container during processing, to minimize the loss of the organic peroxide. Polybutene-1 grade DP8910 meets FDA requirements in 21 CFR 175.105 for adhesives. The value listed as Tensile Modulus, ISO 527-1, -2, was tested in accordance with ISO 1184-1983E. Abrasion Resistance, Good Chemical Resistance, Good Flexibility, Good Toughness, Good Copolymer, Random Random copolymer of butene-1 with high ethylene content. Used as a blend component in hot melt adhesives (HMA) formulations and sealant compounds. Contains free organic peroxide additives. Increases open time. Maintains mechanical integrity at higher temperatures. Can be used in combination with a wide variety of non-polar resins and waxes. Offers highly compatibility with polypropylene. Provides good abrasion and chemical resistance, good flexibility and good toughness. Reduces melt viscosity in elevated temperature processing.