Erisys EMDA 3-23 Adduct of an epoxidized bisphenol A resin and a dimer acid 67989-52-0 CVC Epoxide (EP) >> Bisphenol A based ADHESIVE ERISYS® EMDA 3-23 Dimer Acid Adducted to an Epoxidized Bisphenol A Resin ERISYS EMDA 3-23 is an adduct of a DGEBA resin and a dimer fatty acid. At room temperature EMDA 3-23 is a semi-solid which requires mild heating to assist flow or pumping. The introduction of the fatty acid to the DGEBA backbone yields a resin which will impart a degree of flexibility to cured epoxy formulations. EDMA 3-23 is usually blended with other epoxy resins and/or diluents to improve thermal shock, and impact re-sistance. Improvements in adhesion and peel strength will also be realized. These improvements occur, how-ever, with some sacrifice in heat resistance as exempli-fied by a lowering of Tg with increasing EMDA 3-23 con-centration. EMDA 3-23 is compatible with all standard epoxy resins and curing agents. Adhesives Encapsulating Potting Coatings Toughening of prepreg and composites Semi-solid of dimer acid adducted to an epoxidized bisphenol A resin. Used in adhesives. Provides degree of flexibility to cured epoxy formulations. Can be blended with other epoxy resins and diluents to improve thermal shock, impact resistance, adhesion and peel strength. Possesses compatibility with all standard epoxy resins and curing agents.