Erisys GE-11 Para-tertiary butyl phenyl glycidyl ether 3101-60-8 CVC Solvents >> Ethers & Ethers-alcohols Epoxy (EP) ADHESIVE ERISYS â GE-11 para-tertiary Butyl Phenyl Glycidyl Ether Aromatic Monofunctional Epoxy Reactive Diluent ERISYS GE-11, epoxidized para-tertiary butyl phenol, is an aromatic mono-epoxide. GE-11 is intended for use as a reactive diluent for high viscosity epoxy resins and it is compatible at all concentrations with those resins. Resin/ diluent blends can be cured using any curing agent for epoxy resins. GE-11, due to its aromatic structure, is not as efficient in viscosity reduction as aliphatic diluents ERISYS GE-5, GE-6, GE-7, or GE-8. However, performance properties of epoxy formulations diluted with GE-11 are modified less than those of systems containing the aliphatic mono-functional diluents. Depending on concentration, proper-ties such as gel time, room temperature strength, and modulus of a GE-11 diluted formulation remain relatively unchanged compare to an undiluted resin. However, a decline in elevated temperature performance, as indi-cated by decreasing Tg with increasing GE-11 concentra-tion occurs (see table and graphs below). Cured formula-tions containing GE-11 exhibit excellent moisture resis-tance. ERISYS GE-11's low vapor pressure, low odor and exceptionally low residual epichlorohydrin level make it ideally suited for environmentally difficult applications. Another feature of GE-11 is its ability to reduce the ten-dency of certain epoxy resins to crystallize, thereby pro-ducing formulations with improved homogeneity. Potting & Encapsulation Electronics Flooring Concrete/Civil Engineering Adhesives General Purpose Adhesives Tooling Laminating Epoxidized para-tertiary butyl phenol. Used as a reactive diluent for high viscosity epoxy resins in adhesives. Possesses compatibility at all concentrations with those resins and any curing agent for epoxy resins. Provides very good moisture resistance, low vapor pressure, low odor and very low residual epichlorohydrin level. Reduces tendency of certain epoxy resins to crystallize. Applications : concrete, civil engineering and general purpose adhesives.