Omicure 24EMI 2-Ethyl-4-methyl imidazole CVC Catalysts / Accelerators / Vulcanizing agents Crosslinking / Coupling / Curing Agents Epoxy (EP) ADHESIVE OMICURE ® 24 EMI 2-Ethyl-4-Methyl Imidazole Accelerator for High Temperature Epoxy Resins OMICURE 24EMI is a liquid high temperature performance 2-Ethyl-4-Methyl Imidazole for use in filament winding, electrical laminates, coatings and laminating adhesives. Unlike other grades of EMI, OMICURE 24EMI is non-crystallizing and significantly lower in irritation allowing for easier, safer handling. Because no heat is required for mixing, longer pot lives are achieved. OMICURE 24EMI is typically used at 1-3% as an accelerator for anhydrides or from 2-5% as the sole hardener for catalytic cures. This yields cured resins with better oxidation, aging and im-proved high temperature performance versus MDA. Non-crystallizing low viscosity liquid Easier handling, lower product losses. No heat is required to achieve uniform mixing with excellent pot life vs. solid systems. Well suited to casting and impregnation systems for maximum fiber contact. Low toxicity/less irritating Significantly lower toxicity than most aromatic amines and lower derma-titis potential than other imidazoles results in safer operations. High EDT with low volatility Excellent HDT with low weight loss and shrinkage vs. other curing sys-tems. Results are reduced stress and higher tensile strength. Can yield HDTs higher than cure temperature. Lower cure temperature required Achieves maximum mechanical properties at lower temperatures. Es-pecially useful in induction curing and filament winding. Adhesives Ideally suited for short baked cures at lower temperatures. Excellent adhesion to metal and glass. Good dimensional stability of cured system, even at higher service temperatures. Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature epoxy resin for laminating adhesives. Provides long pot lifes. Offers good oxidation aging and improved high temperature performance. Possesses low toxicity/less irritating and low cure temperature. Gives very good adhesion to metal and glass and good dimensional stability of cured system.