Omicure 33DDS Ground 3,3’-Diaminodiphenyl sulfone CVC Catalysts / Accelerators / Vulcanizing agents >> Amine & Amino compounds Crosslinking / Coupling / Curing Agents >> Amines /Amides >> aromatic Epoxy (EP) PU - Prepolymers ADHESIVE OMICURE ® 33DDS Ground 3,3’ Diaminodiphenyl Sulfone High Temperature Aromatic Amine Curing Agent OMICURE 33DDS is a newly developed version of 3,3' Dia-mino Diphenyl Sulfone. High purity 33DDS is produced in a unique proprietary process using readily available raw materials. These raw materials are halogen free so the ionic levels of OMICURE 33DDS are significantly lower than 3,3' Diamino Diphenyl Sulfone recovered as a reaction by-product. As an epoxy curing agent OMICURE 33DDS is an effec-tive, safer to use replacement for Methylene Dianiline (MDA). Due to its asymmetric structure, 33DDS can yield cured systems with higher compressive strength, less brit-tleness and higher heat deflection temperatures than MDA. Unlike 4,4' DDS, OMICURE 33DDS can cure at rates com-parable to MDA. In polyimid production OMICURE 33DDS exhibits good reactivity. Polyimides produced using 33DDS exhibit higher temperature performance. Prepregs/Composites Castings Chemical Resistant Coatings Polyimid Resins Electronic Adhesives High Temperature Electrical Varnishes Polyurethane Crosslinking Accelerator Ground high temperature aromatic amine curing agent. Used as a curing agent for epoxy and as a polyurethane crosslinking accelerator in electronic adhesives. Possesses low ionic level. Provides high compressive strength, low brittleness and high heat deflection temperatures. Offers good reactivity in polyimide production with high temperature performance.