Omicure DDA 50 Micronized dicyandiamide 461-58-5 CVC Crosslinking / Coupling / Curing Agents >> Amines /Amides >> dicyandiamide Epoxy (EP) ADHESIVE SEALANT OMICURE ® DDA SERIES Micronized Dicyandiamide Systems OMICURE DDA is Dicyandiamide, a solid latent curing agent for epoxy resins. It is offered in several grades de-pending on the desired particle size. OMICURE DDA prod-ucts are dispersed into resin systems where they remain stable until activated by heat. Uncatalyzed, dicyandiamide has an activation temperature of about 350°F and a formu-lated storage stability of over six months. When catalyzed with other latent accelerators like the OMICURE U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperatures of 225-250° F and excellent stability. Epoxy systems cured with OMICURE DDA are character-ized by outstanding adhesion making them the preferred choice for adhesive formulations. They are compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs. They can be used with diluted or undi-luted resins and are compatible with a wide variety of fillers and pigments. OMICURE DDA is safe to handle and is considered non-toxic. One Component Adhesives Powder Epoxy Coatings Prepregs and Film Adhesives Electronic Potting and Encapsulting Compounds Micronized dicyandiamide. Used as a curing agent for epoxy resins in one component, prepregs and film adhesives and sealants. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies and epoxy novolacs), with diluted or undiluted resins and with a wide variety of fillers and pigments.