Omicure U-410 Toluene bis dimethyl urea 17526-94-2 CVC Catalysts / Accelerators / Vulcanizing agents Epoxy (EP) ADHESIVE OMICURE ® U-410 Technical Grade of Toulene Bix Dimethyl Urea OMICURE U-410, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE U-410 to epoxy/ dicy formulations reduces the time and/or temperature re-quired to cure these shelf stable one part products. Compared to the other CVC substituted ureas, toluene bis dimethyl urea provides the greatest degree of acceleration to epoxy/dicy formulations. However, some sacrifice in room temperature shelf life may occur. At concentrations required to provide an equal degree of acceleration, (versus other CVC substituted ureas), toluene bis dimethyl urea, produces the least effect on Tg. OMICURE U-410 is a mixed isomer grade of OMICURE U-24 and is somewhat less expensive. DGEBA/DICY formu-lations accelerated with equal amounts of either of these products will have similar room temperature shelf lives. However, those containing U-410 will cure faster, with pos-sibly a slight decrease in Tg. Suggested use levels of OMICURE U-410 are < 5 phr. Curing can be accomplished in about 30 minutes at 100°C and in about 3 minutes at temperatures > 150°C. Cure times are dependent on the composition of the formulated product and your particular end applications. Room temperature shelf lives (time to double viscosity) of >3 months can be obtained when < 1 phr OMICURE U-410 is used with DGEBA/DICY. Some of the factors which can effect shelf life are formulation ingredients and compound-ing parameters. Ingredients in which OMICURE U-410 is insoluble at processing and storage temperatures will en-hance overall storage stability. OMICURE U-410 can be incorporated into your formulation concurrent with the dicy addition. As a latent accelerator in the dicyandiamide cure of epoxy resins used in: Adhesives Powder Coatings Prepregs Encapsulation qReinforcements Aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Use level : <5 phr.