Genamid 250 Amidoamine Cognis Crosslinking / Coupling / Curing Agents >> Amines /Amides >> amidoamine Epoxy (EP) ADHESIVE Genamid® 250 is a low viscosity amidoamine resin designed for use with solid or liquid epoxy resins. Genamid® 250 offers good compatibility with a wide range of epoxy products and is most commonly used with bisphenol A based epoxy resins that have an epoxide equivalent weight of approximately 190. Genamid® 250 is lower in viscosity than Genamid® 2000 although it is generally slower in cure time. Resin systems based on Genamid® 250 allow low viscosity formulation with high pigment loading. In comparison to many similar curing agents, Genamid® 250 gives rapid cure response. Genamid® 250 is useful in adhesives, electrical encapsulations, laminates and industrial maintenance coatings. It is ideally suited for high solids formulations with low viscosity epoxy resins. Low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is most commonly used with bisphenol A based epoxy resins that have an epoxide equivalent weight of approximately 190. Suits for high solids formulations with low viscosity. Gives rapid cure response.