D.E.R 332 Epoxy Dow Chemical Epoxide (EP) >> Bisphenol A based ADHESIVE D.E.R.* 332 epoxy resin is a high purity bisphenol-A diglycidyl ether. The uniqueness of D.E.R. 332 liquid epoxy resin is reflected in its maximum epoxy equivalent weight of 176 grams/equivalent (the chemically pure diglycidyl ether of bisphenol-A has an epoxy equivalent weight of 170 g/eq). Because of its high purity and low polymer fractions content, D.E.R. 332 epoxy resin assures uniform performance and exceptionally low viscosity, low chloride content and light color. Under some cure conditions this epoxy resin provides improved elevated temperature properties over standard bisphenol-A based epoxy resins such as D.E.R. 331 epoxy resin for example. D.E.R. 332 epoxy resin is used mainly in filament winding, electrical laminates and encapsulation applications. A wide variety of curing agents is available to cure this liquid epoxy resin at ambient conditions. Most frequently used are cycloaliphatic polyamines, polyamides, amidoamines, and modified versions of these. These systems are sometimes cured at elevated temperatures to improve selected properties such as chemical resistance and glass transition temperature. Elevated temperature cures are necessary and long post-cures are required to develop full end properties if anhydride or catalytic curing agents are employed. NOTE: D.E.R. 332 epoxy resin might crystallize. This reversible, physical phenomena can be greatly avoided by storing the resin at temperatures not below 25ºC. Adhesives High purity bisphenol-A diglycidyl ether. Offers uniform performance and good low viscosity, low chloride content and light color. Provides improved elevated temperature properties over standard bisphenol-A based epoxy resins. Can be cured by cycloaliphatic polyamines, polyamides, amidoamines, and modified versions of these. Gives improved chemical resistance and glass transition temperature when cured at elevated temperatures.