D.E.R 755 Epoxy Dow Chemical Epoxide (EP) >> Bisphenol A based ADHESIVE D.E.R.* 755 liquid epoxy resin is a flexibilized epoxy resin based on reaction products of epichlorohydrin with bisphenol-A and polypropylene glycol. Typically, bisphenol-A/F-epichlorohydrin based resins, novolac based epoxy resins and other di- or multifunctional resins, containing the aromatic ring structure, will cure to hard, rigid compositions having rather low impact and elongation characteristics. D.E.R. 755 epoxy resin has been designed to impart flexibility to what may otherwise be rather brittle epoxy binder systems. When used in combination with cycloaliphatic amine - epoxy adduct curing agents, formulations can be made with high elongation at break which makes this product suitable for application in adhesives. A broad range of curing agents is available to cure this high performance resin at ambient temperatures. The most frequently used are aliphatic and cycloaliphatic polyamines and modified versions of these. Elevated temperatures are necessary for cure, and post-cure is required to develop full end properties if anhydride or catalytic curing agents are employed. Adhesives Flexibilized epoxy resin based on reaction products of epichlorohydrin with bisphenol-A and polypropylene glycol. Provides hard, rigid compositions having rather low impact and elongation characteristics. Offers high elongation at break when used in combination with cycloaliphatic amine-epoxy adduct curing agents Can be cured by aliphatic and cycloaliphatic polyamines and modified versions of these.