Thixatrol Plus Elementis Rheology Modifiers / Thickeners SEALANT ADHESIVE >> Hot-melt >> Pressure sensitive (HMPSA) ADHESIVE >> Solvent based THIXATROL PLUS is a 100% active, seed resistant organic rheological additive. THIXATROL PLUS efficiently provides viscosity, thixotropy and sag control in both conventional and high build systems. Attributes THIXATROL PLUS rheological additive: provides viscosity control, thixotropy and excellent sag resistance. is seed-resistant and allows high processing, packaging and storage temperatures without seeding. is an easy-to-incorporate powder. reduces brush drag and produces excellent paint application properties is a cost effective 100% active powder has high tolerance to various solvents Incorporation The improved seed-resistance of THIXATROL PLUS rheological additive makes paint manufacturing easier and less expensive. THIXATROL PLUS performance is not adversely affected by high processing temperatures or extended processing times. THIXATROL PLUS has specific processing temperature and dwell time requirements in order to develop optimum properties. It should be introduced at the beginning of the manufacturing process in order to guarantee sufficient wetting and dwell time to ensure complete activation. During the pigment dispersion phase, sufficient shear will be applied and at the same time THIXATROL PLUS will benefit from the temperature developed during this process to ensure maximum performance. Recommended* processing temperatures are: Aliphatic: 66°C-71°C / 150°F-160°F Aromatic: 49°C-54°C / 120°F-130°F Oxygenated: 43°C-49°C / 110°F-120°F Levels of Use Typical levels of use for effective flow control range from 0.5% to 2.0% of the total system weight. If only improvement in the antisettling activity of the system is required, 0.2% TO 0.5% may be sufficient. The optimum level of THIXATROL PLUS will vary depending on the type of system. When formulating a new system a loading ladder study is recommended to determine the precise level of additive needed. 100% active, seed resistant organic rheological additive. Can be used in adhesives and sealants. Provides viscosity, thixotropy and sag control. High tolerance to various solvents. Typical levels of use: 0.5% - 2.0% of the total system weight.