HyComp 500 Benzoxazine HyComp Aminoplaste / Phenoplaste (UF, MUF) SEALANT ADHESIVE HyComp® 500 benzoxazine resin, is the low cost option for high temperature composite parts commonly made of bismaleimides, with the added advantage of easier processing. Cures at 200-220°c in 10-20 minute cycles. Can be compression moulded or extruded. Long-term operation up to 450°F Easy to work with Near-zero cure shrinkage Co-cures with epoxies, phenolics, and polyamine HyComp® 500 resin co-cured with epoxy resin preserves the desirable properties of the epoxy and adds the benefit of faster cure and greater thermal stability. Resin powder soluble in NMP, THF, DMAC, etc. Ideally suited for adhesives, bearings and seals. Benzoxazine resin. Used in adhesives and sealants. Provides easy processing and long-term operation up to 450°F. Co-cures with epoxies, phenolics, and polyamine. Offers fast cure, no shrinkage and great thermal stability.