SP 1055 Brominated octylphenol and formaldehyde Schenectady International Aminoplaste / Phenoplaste (UF, MUF) >> Phenol Formaldehyde ADHESIVE >> Hot-melt >> Pressure sensitive (HMPSA) SP-1055 is a brominated octylphenol/formaldehyde heat reactive resin. This resin is made by a semi-continuous process which is fully automated. This allows for a consistent quality product with batch sizes in excess of a full truck load. SP-1055 may be used with butyl rubber or other unsaturated elastomers with or without functionality. The presence of functionality allows for a faster cure. SP-1055 is unique in that it does not require a halogen donor. The use of brominated resins in compounding is especially effective when the rubber may be exposed to heat or repeated use. The rubber will not deteriorate as quickly as rubber crosslinked with other curing agents. Rubbers compounded with SP-1055 exhibit exceptional scorch safety, high temperature stability, and excellent dynamic properties. SP-1055 has a slower cure than SP-1056, due to a lower bromine content. Brominated heat reactive phenolic resins are also used to partially crosslink elastomers to create pressure sensitive adhesives. This gives the pressure sensitive adhesive improved cohesive strength while imparting little color to the finished adhesive, thus allowing for clearer film formation. Brominated octylphenol/formaldehyde heat reactive resin. Used in pressure sensitive adhesives. Provides improved cohesive strength and little color to the finished adhesive.