Low viscosity amidoamine resin. Reacts with solid or liquid epoxy resins. Can be used as all or part of the curing agent component in high solids adhesives and sealants. Provides long pot life.

Modified polyamide/epoxy adduct. Used as curing agent and surfactant for liquid epoxy resins in waterborne and solvent-free sealants.

Modified polyamide/epoxy adduct. Used as curing agent for fluid epoxy resins in adhesives and putties applying under critical atmospheric conditions, on wet surfaces and even underwater. Provides...

Formaldehyde-free tertiary amine accelerator and curing agent. Used for epoxy resins in adhesives and polyurethane foams. Provides fast reactivity with polymercaptan, polyamide, polyamine...