Dispersible, random copolymer of butene-1 with high ethylene content. Used as a blend component in hot melt adhesives (HMA) formulations and sealant compounds. Increases open time. Maintains...
Random copolymer of butene-1 with high ethylene content. Used as a blend component in hot melt adhesives (HMA) formulations and sealant compounds. Contains free organic peroxide additives. Increases...