Rescoll Technological Center's patented INDAR process is designed to debond structural adhesive joints on command, making disassembly of adhesive-bonded parts technically and
economically feasible and changing the industrial outlook on structural adhesives. The results presented in this paper concern epoxy matrices,
although a number of other substrate/adhesive combinations
were also tested. Innovative Dismantling Adhesives Research
technology, or INDAR, is quite versatile. It can be used with many
different combinations of a broad range of structural adhesives
(including epoxies, especially aerospace grades, UV-cure adhesives,
polyurethane or silicone glues, and more), substrates (such as steel,
glass, or aluminium), and surface treatments (including chromicsulphuric
bath, sand blasting, wire-brushing, and solvent cleaning),
at different activation temperatures.
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