Epoxyset Launches EB-350-3LV, One Component Epoxy Encapsulant
- Jul 4, 2012
EB-350-3LV is a unique, one component epoxy encapsulant with excellent flame-out and fast curing capabilities at moderate temperatures. The cured material exhibits excellent resistance to thermal shock and offers continuous service up to 200°C. It is particularly well suited for transistors and semiconductors. EB-350-3LV can be used as either an adhesive for bonding and tacking applications or as a glob top encapsulant for PCB applications. Also, an excellent alternative to potting small components that require less than 100g of material. With a very workable viscosity of 60,000 cPs, EB-350-3LV can be either manually dispensed or used in automated machines. EB-350-3LV is available in pint, quart, and gallon containers as well as 5cc, 10cc, 30cc, and 300cc disposable syringes.
Epoxyset is one of the leading manufacturer of custom formulated adhesives and potting compounds used in advanced technology applications. The company supplies superior quality products that are used in electronic and microelectronic, medical device, semiconductor, fiber optics, and aerospace industries.
Epoxyset is committed to providing its customers with the best products possible as well as unparalleled service. Customers have the option to choose from its wide array of standard proven products or allow us to assist you in creating new formulations specific to the application criteria.
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