Aremco Unveils Aremco-Bond 820 Epoxy System for General Purpose Bonding
- Aug 16, 2012
Aremco-Bond 820, a high temperature, flexible epoxy system developed by Aremco Products, Inc., is now used for general purpose bonding of ceramics, glass, plastics, metals and other substrates for applications to 400 °F (204 °C).
Aremco-Bond 820 High Temp Flexible Adhesive Now Available
Aremco-Bond820 is a clear, unfilled, 100% solids, 1-to-1 mix ratio, flexible epoxy system which can be used in applications to 400 °F (204 °C).
Flexural and tensile shear strengths are 8,000 and 1,200 psi, respectively. The volume resistivity is 2.0 x 1014 ohm-cm; dielectric strength is 860 volts per mil; and the dielectric constant is 6.0 at 1.0 kHz.
Aremco-Bond 820 exhibits exceptional adhesion to ceramics, glass, metals and plastics substrates, and demonstrates outstanding chemical resistance to acids, alkalis, organic fluids and salts.
Aremco-Bond 820 mixes easily in a 1-to-1 ratio, providing a mixed viscosity of 12,000 cps and cure time of 45 minutes at room temperature. The Shore-D hardness is 70 and shrinkage is less than .008 in/in upon curing.
Aremco-Bondt 820 is supplied in pre-filled 50ml dispense cartridges, as well as pint, quart, and gallon kits. Cartridges can be loaded to mechanical or pneumatic guns for automatic mixing and dispensing.
Formed in 1965, Aremco's advanced materials division has been a leader in the development and production of technical ceramics, adhesives, coatings, sealants and potting compounds for applications to 3200°F. These materials are used throughout industry in the design of sensors, electrical components and analytical instruments, as well as the maintenance and repair of high temperature process equipment.
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