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Low application temperature hot melt packaging adhesives comprising a vegetable derived wax such as a soy wax are described. Hot melts for packaging applications such as case and carton sealing are typically composed of a polymer, a diluent or tackifier, and a wax. One function of the wax component, due to its low molecular weight, is to lower viscosity. Currently used packaging adhesives...
Source : Haner, Dale L. (Ringwood, NJ, US), Gong, Lie-zhong (Bridgewater, NJ, US), United States Patent Application 20080249233, published 10/9/2008, assigned to National Starch and Chemical Company (P.O. BOX 6500, Bridgewater, NJ, 08807-3300, US).
SpecialChem4Adhesives Members Reactions
- Feb 02, 2012
posted by p.pralay shankar, R&D - Applied/ Formulation/ Product development at plastimen industries