Patent - A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2HCOOR2 (where R2 is an alkyl group having 11...

Source : PAT 02-21-12 08119236 NDN- 269-3746-0916-3 INVENTOR- Kamiya, Katsuhiko; Matsumura, Takeshi; Murata, Shuuhei; Ootake, Hironao PATENT NUMBER- 08119236 PATENT APPLICATION NUMBER- 533272 DATE FILED- 2009-07-31 PATENT DATE- 2012-02-21 NUMBER OF CLAIMS- 10 EXEMPLARY CLAIM- 1 FIGURES- 7 PATENT CLASS- Invention (utility) patent INVENTOR COUNTRY OR ZIPCODE- JPX; JPX; JPX; JPX PATENT ASSIGNEE- Nitto Denko Corporation ASSIGNEE CITY- Osaka ASSIGNEE COUNTRY- JPX FIRM- Knobbe, Martens, Olson & Bear LLP US PATENT CLASS- 428343000O US CLASSIFICATION REFERENCE- X428354000; X428355000 INTERNATIONAL PATENT CLASS- B32B00712; B32B01504 SERIES- 2008 PATENT REFERENCE- 4961804; 5648425; 2004/0210006; 2005/0139973; 2010/0028687; 2010/0029059; 2010/0029061 FOREIGN DOCUMENT REFERENCE- 60-057642; 2-248064; 2005-005355; 2006-165074; 2006-303472; 2008-009489; 2008-159998 FOREIGN COUNTRY CODE- JPX; JPX; JPX; JPX; JPX; JPX; JPX PATENT APPLICATION PRIORITY- 2008-200983 PRIORITY COUNTRY CODE- JPX PRIORITY DATE- 20080804 NEW CLASSIFICATION- 428343000O CURRENT CLASSIFICATION REFERENCE- X428354000; X428355000 RELATED PAPER- 20100029060/US-A1

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