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Patent -
High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300degrees F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.
The invention provides...
Source : APN 05-24-12 20120128833/US-A1 NDN- 041-1357-7170-1
INVENTOR- Patel, Jagruti B. Branchburg, NJ, US
INVENTOR- Eodice, Andrea Keys Manville, NJ, US
INVENTOR- Low, Yew Guan Basking Ridge, NJ, US
PATENT APPLICATION NUMBER- 361197/13
DATE FILED- 2012-01-30
PUBLICATION NUMBER- 20120128833/US-A1
PUBLICATION DATE- 2012-05-24
US PATENT CLASS- 426106000O; X524275000; X156334000
INTERNATIONAL PATENT CLASS- C09J19106 ; B65D03300; B32B03712; B65D02500
SpecialChem4Adhesives Members Reactions
Good work - Jun 29, 2012
posted by Mahendra Doshi, Corporate Management at Industrial Adhesives Pvt Ltd
Iam in the hma mfg industry for past 25 years --Very happy to learn about this new development ---would be very interested in knowing more about it ---
SpecialChem4Adhesives Members Reactions
