Polyamide hot melt adhesives are used in a variety of industrial applications. Possessing
a broad range of adhesive properties, most polyamide adhesives are characterized
for exhibiting excellent adhesion to a wide variety of substrates, bonding well
to porous substrates, as well as possessing good chemical and oil resistance, and
showing good adhesion over a wide range of service temperatures.
Most polyamides, particularly the dimer acid polyamides, are prone to oxidation
and must be stabilized by antioxidants. Although the stabilizers will vary with
the polyamide, the most common antioxidants that are used are hindered phenols,
phosphites, phosphates, and hindered aromatic amines. Generally a blend of antioxidants
Phenolic antioxidant, is able to stabilize polyamide hot melt adhesives against
degradation occurring at high temperatures. Alternative stabilizers are aromatic
amine, which may be used either alone or in combination with other antioxidants.