Thanks to the availability of high MFI
grades, formulators can adjust the melt viscosity of their formulation
in order to facilitate application at lower temperatures than usual in
many packaging or assembly applications.
With the high formulation versatility
of ethylene copolymers, the adhesion/cohesion balance can be preserved
even with a product applicable at temperatures as low as 130°C, resulting
in reduced maintenance and energy cost.
A lower application temperature
may also result in less fumes and odor. These performances can be enhanced
by the high thermal stability and high adhesion performances of hot-melts, which will be chosen when formulators want to achieve
high performances and long term ageing properties with a low application
temperature hot-melt.
