Improve productivity and reduce operative costs of your packaging adhesive formulation thanks to SBC technology
The Challenge
Hot melt adhesives (HMA) are widely used in packaging applications like carton box
closing, labels and tapes. Usually packaging cardboard boxes are assembled just
before artifact packaging operation. Bonded closures undergo natural constraints
of cardboard tending to unfold.
As a consequence, adhesives must be selected to develop higher cohesive strength. Futhermore, automatized packaging manufacture requires, fast development cohesive strength so as to improve productivity. When packaging are sealed with tapes, high shear is an additional requirement to high cohesive strength. SBC's based adhesives offer an extensive range of solutions to satisfy HMA requirements for packaging applications.
SBC's Key advantages
Case Study 1:
Dynasol Solprene® 4301 is preferred to formulate HMA because it allows to improve
cohesive strength. Fomulated with Solprene® 4318, adhesive viscosity can be
reduced. As a result, the temperature required for the application is lower, improving
adhesive set time, and the productivity.
Figure 1: Improve adhesive cohesive performance and reduce adhesive viscosity using Dynasol SBC's Adhesives characterization results:
Case Study 2:
Dynasol S-SBR is widely used for partial substitution of SIS polymer in tapes HMPSA,
preventing formulators from SIS shortage impact and offering additional advantages
such as adhesive viscosity reduction and improved shear resistance.
Viscosity reduction can be used to apply adhesive at lower temperature reducing energetic cost and / or increasing application lines speed to improve productivity.
Figure 3: Reduce adhesive viscosity and improve Shear resistance using Dynasol S-1205 for SIS partial substitution in HMPSA Adhesives Characterization results:
Case Study 3:
Finally, Packaging adhesive systems should maintain properties trough a wide temperature
range during transportation in different geographical zones.
Figure 5: Select right polymer to develop optimal temperature performance Adhesives Characterization results:
Some advantages of formulating HMPSA for packaging application using Dynasol SBC's are:
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