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Numerous hot-melt formulators refers to a need of polymer withstanding higher temperature processing while preventing to turning into gel as long as possible for batch and continuous productive process.
Dynasol, to address this market will, has developed the last SSBR generation, Solprene® 1217.
Because of its multiple advantages, hot-melt formulators can now overcome soft points of other conventional polymers on the market place.
- Longer thermal stability of the polymer allows for bigger tank load, resulting in reduced maintenance cost
- No gel formation at higher production rates in continuous process reducing filters changes and related costs
- Formula costs reduction by using lower stabilizer level
Accelerated oxidation at 160® C in oxygen atmosphere
Figure 1: Thermal stability of polymer by Oxidation Induction Time (DSC)
- Low viscosity maintained on a broader period of time ensures both an increased shelf-life of the adhesive in the final application and the ease of use.
Figure 2: Thermal stability of adhesive S-1217 helps hot melt manufacturers increase productivity and reduce operating cost.
Additionally, improves final user productivity by applying the adhesive at higer temperatures / lower viscosities.
The new copolymer can also be used as a substitute for SIS copolymers in adhesive formulations, and can be applied in a variety of uses - such as tapes, labels, bandages, disposables, packaging, and many others due to its unique benefits.
 Visit the Styrene Block Copolymers Center
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