SBC-based adhesives, in high demanding industries, can cope with every market characteristics which are influencing the packaging adhesive demand.
The SBC-based adhesives can be used in high-speed application lines, for which hot melts offer competitive performance characteristics over liquid adhesives.
The types of substrates used in packaging are diversifying and becoming more complex (i.e., recycled paper and board, coated papers, plastic films), which impact the adhesion performance requirements.
The wide range of SBCs highly facilitates the choice of the ideal formulation for the specific application.
Environmental aspects such as packaging material recycling are becoming very important and require that the adhesive be separated easily from the packaging material. SBC-based adhesives cope perfectly with this trend.
The examples below highlight how beneficial SBC can be in distinct formulation type.
Assembly Hot Melt Non PSA
Fast Setting adhesive to improve line productivity
- Optimal adhesion cohesive balance
- Wide range of structures to obtain maximal adhesion at process temperature
Non Pressure Sensitive Adhesives Hot Tack measurements used
to improve productivity in packaging process
Adhesive characterization results for HMNPSA formulated
using different SBC's with different structures
- Higher shear performance
- Lower Softening point Temperature
- Capability for low temperature application
|Figure 3: Low viscosity anti-slip Hot Melt Adhesive |