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Omicure™ DDA 10

Supplier:

Emerald Performance Materials

Product performance:

Micronized dicyandiamide. Used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic Potting and encapsulating compounds. Can be catalyzed with other latent... Accessible upon free registration

Applications / Recommended for:

Accessible upon free registration
TYPICAL PROPERTIES VALUE UNIT
Melting point Accessible upon free registration °C
Melamine content Accessible upon free registration %
Moisture content (loss @ 105°C) Accessible upon free registration %

Product type:

  • Crosslinking / Coupling / Curing Agents >> Amines /Amides >> dicyandiamide
    •

    Chemical composition:

      Micronized dicyandiamide

    Physical form:

      Powder

    CAS Number:

      461-58-5

    Other products with same trade name:

  •   Omicure™ 24EMI
  •   Omicure™ 33DDS
  •   Omicure™ BC-120
  •   Omicure™ DDA 100
    •
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