Fast Cure Epoxy-Mercaptan Adhesives

Applicable Type Reactive Adhesives
Applicable Base Polymer Epoxides (EP)
Applicable Industrial Sectors Electrical & Electronic Bonding, Industrial Assembly

TYPICAL FORMULATION INGREDIENTS AND PROPERTIES

  Ingredient Parts by weight  
   EPON Resin 828 (EEW 190)  100  
   ... and 2 more ingredients    
  Properties  
  Gel time, mins @ 25°C  
 
  • 60 gm mass
  • 2.5  
     
  • 0.015 inch film
  • 5.5  
      Set time (sand track free), mins 6  
      Pencil hardness, 0.015 inch @ 25°C  
     
  • 1 hour
  • 2B  
     
  • 24 hours
  • 4H  
      Exotherm, °C, 60 gm mass 194  
      Hardness, Shore D @ 25°C, cured  
      • 5 minutes 18  
      • 15 minutes 22  
      • 30 minutes 66  
      • 60 minutes 7  
      • 8 hours 74  
      • 24 hours 78  

    PROCESSING

    APPLICABLE BASE POLYMER PROPERTIES

    Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. The polymercaptans can also be used to accelerate the curing of epoxy resins systems blended with polyamines, amidoamines, or amines. The other curatives serve as the base to accelerate mercaptans, and the mercaptans react rapidly, generating the heat to accelerate the cure with the other hardener.
    The major disadvantages of mercaptan curing agents are their odor, skinning, and low heat deflection temperature.

    RESULTING PROPERTIES

    Typical starting formulations for rapid setting, room temperature curing epoxy mercaptan adhesive formulations are shown in the above table. The reaction of these materials when used alone is very sluggish at room temperature. However, the reaction proceeds at a practical rate by the addition of a base, which acts as an accelerator. Tertiary amines, such as DMP-10 or 30; triethylene tetramine (TETA), and diethylene triamine (DETA) are commonly used for this application.

    TIPS & TRICKS

     

    Adhesives and Sealants Formulation Bulletin
    SpecialChem4Adhesives Industry Letter
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