Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. However, the resistance to a specific environment is greatly dependent on the type of epoxy curing agent used. Anhydride cured systems are frequently preferred for heat resistance.
RESULTING PROPERTIES
Certain epoxy adhesive formulations, however, have been able to withstand short terms at 250°C and long term service at 150-180°C. These systems were formulated specifically for thermal environments by incorporation of stable epoxy coreactants or high temperature curing agents (e.g., anhydrides such as BTDA) into the adhesive. The high temperature properties of an epoxy adhesive formulation cured with BTDA are given in the table above.