High Temperature Epoxy Adhesive

Applicable Type Reactive Adhesives
Applicable Base Polymer Epoxides (EP)
Applicable Industrial Sectors Automotive, Electrical & Electronic Bonding, Industrial Assembly, Transportation (excl. Automotive)

TYPICAL FORMULATION INGREDIENTS AND PROPERTIES

  Ingredient Parts by weight  
   Epoxy resin (EEW = 190)  100  
   Benzophenone tetracarboxylic dianhydride (BTDA)  48  
   ... and 2 more ingredients    
  Properties  
  Cure conditions 2 hrs at 200°C  
  Shear strength, psi, on acid etched aluminum tested at:  
  • 23°C 2300  
  • 150°C 1600  
  • 260°C 1220  

PROCESSING

APPLICABLE BASE POLYMER PROPERTIES

Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. However, the resistance to a specific environment is greatly dependent on the type of epoxy curing agent used. Anhydride cured systems are frequently preferred for heat resistance.

RESULTING PROPERTIES

Certain epoxy adhesive formulations, however, have been able to withstand short terms at 250°C and long term service at 150-180°C. These systems were formulated specifically for thermal environments by incorporation of stable epoxy coreactants or high temperature curing agents (e.g., anhydrides such as BTDA) into the adhesive. The high temperature properties of an epoxy adhesive formulation cured with BTDA are given in the table above.

TIPS & TRICKS

 

Adhesives and Sealants Formulation Bulletin
SpecialChem4Adhesives Industry Letter
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