Thixotropic One Component ET Epoxy Adhesive

Applicable Type Reactive Adhesives
Applicable Base Polymer Epoxides (EP)
Applicable Industrial Sectors Automotive, Buildings & constructions, Electrical & Electronic Bonding, Transportation (excl. Automotive)

TYPICAL FORMULATION INGREDIENTS AND PROPERTIES

  Ingredient Parts by weight  
   Epoxy resin – 1  A (Control) 47
B 40
 
   Epoxy resin – 2  A (Control) 22
B 18.7
 
   Dicyandiamide  A (Control) 3.7
B 3.1
 
   ... and 4 more ingredients    
  Properties  
  Viscosity  
  Initial 86
91
 
  Aged 105
120
 
  Slump resistance (1/2”x1/2”x4”) No movement
No movement
 
  Tensile shear strength, psi  
  Initial 1770
1801
 
  250 hr humidity 1579
1727
 
  250 hr salt spray 1288
1592
 
  250 hr salt spray 1288
1592
 

PROCESSING

APPLICABLE BASE POLYMER PROPERTIES

Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. However, the resistance to a specific environment is greatly dependent on the type of epoxy curing agent used. Thixotropic agents are used to provide non-sag properties. At one time asbestos fiber was used as the main thixotrope; however, today this has been replaced by other fibrous fillers such as cellulose fiber.

RESULTING PROPERTIES

The above table shows a comparison of properties using fumed silica and cellulose fibers in a 1K, elevated temperature curing epoxy adhesive formulation. Note that a certain percentage of fumed silica is still required in the cellulose fiber filled formulations for optimal non-sag properties. The cellulose fibers’ low specific gravity (1.1) relative to other filler materials also contribute to weight savings that further improves the sag resistance of these systems.

TIPS & TRICKS

 

Adhesives and Sealants Formulation Bulletin
SpecialChem4Adhesives Industry Letter
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